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電子產(chǎn)品失效分析技術(shù)服務(wù)介紹

發(fā)布日期:【2021-04-26 14:54:16】 瀏覽次數(shù):

電子產(chǎn)品失效分析技術(shù)服務(wù)介紹
Introduction of Failure Analysis Technical Service for Electronic Products

 
        失效分析是對(duì)已失效的產(chǎn)品進(jìn)行的一種事后分析工作。通過使用各種測(cè)試分析技術(shù)和分析程序確認(rèn)樣品的失效現(xiàn)象,分辨其失效模式和機(jī)理,查找其最終的失效原因。提出改進(jìn)設(shè)計(jì)、物料、制造工藝、檢測(cè)方法等方面的建議,來降低或消除同機(jī)理的失效再次發(fā)生,提高電子產(chǎn)品可靠性。它是可靠性工程的核心技術(shù)。
??        Failure analysis is a kind of post analysis work for the failed products. Through the use of various test and analysis techniques and analysis procedures to confirm the failure phenomenon of samples, identify the failure mode and mechanism, and find the final failure reason. The suggestions on improving design, materials, manufacturing process and testing methods are put forward, which can reduce or eliminate the failure of the same mechanism and improve the reliability of electronic products. It is the core technology of reliability engineering.
   失效分析技術(shù)服務(wù)方式Service Mode of Failure Analysis
● 單項(xiàng)分析檢測(cè)Single Test Items
● 電子元器件失效機(jī)理分析Failure Mechanism Analysis
● 重大故障模式的專題研究改進(jìn) Thematic Research and Improvement of Major Failure Modes        
   分析對(duì)象Analysis Object
● 單片集成電路                                                     Monolithic
● 混合集成電路                                                      Hybrid IC
● PCBA組件                                               PCBA Subassembly
● 分立元件                                                Discrete Component
● 分立器件                                                     Discrete Device
● 小型整機(jī)                                                            System
● 機(jī)電組件                                     Electromechanical Subassembly
● 光電器件                                             Optoelectronic Devices
   失效分析的主要技術(shù)手段Techniques for Failure Analysis
● 失效信息調(diào)查與分析            Investigation and Analysis of Failure Information
● 整機(jī)級(jí)/板級(jí)故障定位                          Fault Locating for System/ PCBA
● 外觀形貌分析                                         External Visual Analysis
● 電性能分析                                   Electrical Characteristic Analysis
● 應(yīng)力激發(fā)試驗(yàn)                                           Stress Excitation Test
● (非)破壞性物理分析                     (Non)Destructive Physical Analysis
● 制樣/開封                                          Sampling/ Decapsulation
● 微觀形貌分析                                     Micro morphology analysis
● 成份分析                                              Composition Analysis
● 微觀電特性分析                     Analysis of micro electrical characteristics
   失效分析輸出的成果 Result
●  單項(xiàng)分析結(jié)果                                   Results of Single Item Analysis
●  失效機(jī)理分析報(bào)告                          Failure Mechanism Analysis Report
●  專題研究報(bào)告                                      Thematic Research Report
   產(chǎn)生的效益 Benefits
● 糾正設(shè)計(jì)和研制中的錯(cuò)誤          Correct the Error in Design and Manufacturing
● 縮短研制周期,降低研制成本Shorten the Manufacturing Period and Reduce the Cost
● 提高成品率及產(chǎn)品可靠性                        Increase the Yield and Reliability
● 明確引起產(chǎn)品失效的責(zé)任方        Make Sure the Responsibility of Product Failure
   技術(shù)服務(wù)的委托流程Procedure for Technological Service
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注:委托單即任務(wù)申請(qǐng)單,是一份簡(jiǎn)易的技術(shù)服務(wù)合同,報(bào)告將根據(jù)委托單編制。
Note: the entrustment form is the task application form, which is a simple technical service contract. The report will be prepared according to the entrustment form

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